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Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the drain tab.
R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) R θ JA = 38oC/W when mounted on a
1 in2 pad of 2oz copper.
b) R θ JA = 96oC/W when mounted on a
minimuim pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
MTD3055V Rev. A
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